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Functional Partitioning Analysis Optical Component Place/Align/Affix Material Acquisition & Handling Design Verification Testing (DVT)
Physical Partitioning TE Cooler /Case/Submount Attachment Kit Release & Control Qualification Testing
Substrate Technologies Hybrid Circuit Fabrication & Attachment Use of Manufacturing Cells Manufacturing Test
Reliability/Failure Modes Analyses Module Hermetic Seal Use of Centrally Located Resources Test Software Methods & Control
Thermal/Mechanical Analyses Classified Software Loading Automation Test Data Acquisition & Archiving
Environmental Compatibility Analyses   Custom Anti-Tamper Solutions WIP Tracking & Reporting
Product Cost Analyses   Low Cost Packaging Alternatives Manufacturing Change Management
Analog/Digital Design   Part Traceability to Lot or Wafer
Optical Design  
Electrical Analog/Digital Wave Design  
Mechanical Design
Design Verification Testing (DVT)
Active & Passive Design Guidelines




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Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2008 Teledyne Technologies Incorporated. All rights reserved.