Teledyne Microelectronic Technologies manufactures standard and custom power devices designed to withstand the most rigorous of requirements.
We design and manufacture standard and custom Solid State Power Controllers and Switching devices for load control and power control & distribution ranging from full hermetic to COTS to plastic devices for Military, Aviation and Space applications. We offer next level assemblies by packaging multiple devices on a bus-mounted PCB with integrated control and communications electronics.
We offer build to print services for power devices, including Actuator/Motor Control, Battery Chargers, 3 Phase Power Bridges, DC/DC Converters, Power Conditioners and EMI Filters.
Our power packaging techniques include: Kovar or molybdenum based packages, DBC (Direct Bond Copper) package with hermeticity, PEM (Plastic Encapsulated Microcircuit), Copper-Kovar buttwelded power leads for up to 300 A, Copper cored power leads for low loss, DBC with extended power leads for low cost, Power COB (Chip on Board), Rad hard packaging, Low current (2 A) PEM BGA packaging
Give us your most complex circuits and we will: enhance your design for manufacturability, miniaturize size and reduce weight, maintain or enhance performance and reliability, maximize thermal management, and provide comprehensive testing and screening.