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DVT Prototyping
 

  • The DVT Prototyping activity provides an "early warning" regarding
    • Functional performance margins
      • Basic performance
      • Performance over temperature
      • Performance over power supply regulation and ripple limits
    • Test requirements
      • In process
      • Final ATP
    • Yield expectations(scrap and rework)
    • All of the above influences the Design to Unit Production Cost (DTUPC) assessment

Protopype Die Attach & Wire Bonding (click to enlarge)
Prototype Die Attach
&
Wire Bonding





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Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
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