Teledyne Microelectronic Technologies A Teledyne Technologies Company   

Home    Company Info    Products & Services    Teledyne Companies


New Products
PC605
HRIP Optical Communication Devices
Alphalight™ LED Backlights

Packaging Solutions
Mixed Signal
LED Backlights & Illuminators
Medical
Optoelectronics
Power
RF/Microwave
Secure Communications
Space

Technology
Capabilities
Tools

Company Info
About Us
Quality Assurance
DOD Trusted Source
Press Releases
Tradeshows
Environmental Policy
Terms and Conditions
Supplier Information

Contact
Contact Us
Sales Representatives
Map & Directions
Search
DVT Prototyping
 

  • The DVT Prototyping activity provides an "early warning" regarding
    • Functional performance margins
      • Basic performance
      • Performance over temperature
      • Performance over power supply regulation and ripple limits
    • Test requirements
      • In process
      • Final ATP
    • Yield expectations(scrap and rework)
    • All of the above influences the Design to Unit Production Cost (DTUPC) assessment

Protopype Die Attach & Wire Bonding (click to enlarge)
Prototype Die Attach
&
Wire Bonding





Home | ISO 9001 | Terms of Use | Careers | Search | Contact

Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2008 Teledyne Technologies Incorporated. All rights reserved.