| Reliability/Failure Modes Analyses
- Maximized use of standard/qualified processes
- MTBF Predictions (MIL-HDBK-217 Method)
- Hermetic Requirements Analysis
- Use of organic compounds (residual gas requirement
compatibility)
- Cover seal
- Failure Modes/Trends of Candidate Processes
- SPC Database
- Destructive Physical Analysis (DPA)
- Failure Analyses
- Scanning Electron Microscope (SEM)
- Energy Dispersive X-Ray (EDX)
- Radiography (X-Ray) - conventional and real time
- Sonoscan & Ionography
- Precision Cross Sectioning (surface etching/lapping)
- Microprobing
- High Resolution (3-D) Digital Imaging
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SPC Data
Showing Dendritic
Growth
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